×

Chemical content NXS0108BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXS0108BQ-Q100SOT764-1DHVQFN2029.02739 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690991115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0240060.000000.08268
ImpurityNon hazardousProprietary0.000020.039500.00005
PolymerResin systemProprietary0.0159839.951410.05505
subTotal0.04000100.000000.13778
DieDoped siliconSilicon (Si)7440-21-31.40200100.000004.82992
subTotal1.40200100.000004.82992
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700036.47989
Iron (Fe)7439-89-60.260742.400000.89824
Phosphorus (P)7723-14-00.003260.030000.01123
Zinc (Zn)7440-66-60.010860.100000.03743
subTotal10.86402100.0000037.42679
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.64159
FillerSilica -amorphous-7631-86-90.571483.490001.96878
Silica fused60676-86-013.8892084.8200047.84860
PigmentCarbon black1333-86-40.026200.160000.09026
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.60925
Epoxy resin systemProprietary0.260361.590000.89695
Phenolic resinProprietary0.368442.250001.26927
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.08724
subTotal16.37491100.0000056.41194
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00950
Nickel (Ni)7440-02-00.2509591.000000.86453
Palladium (Pd)7440-05-30.022068.000000.07600
subTotal0.27577100.000000.95003
WirePure metalCopper (Cu)7440-50-80.0682696.550000.23514
Pure metal layerGold (Au)7440-57-50.000250.350000.00085
Palladium (Pd)7440-05-30.002193.100000.00755
subTotal0.07069100.000000.24354
total29.02739100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.