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Chemical content PBHV8515QA

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Type numberPackagePackage descriptionTotal product weight
PBHV8515QASOT1215DFN1010D-31.30000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069064147612601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02308
FillerSilver (Ag)7440-22-40.0252084.000001.93846
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23077
Isobornyl Methacrylate7534-94-30.001505.000000.11538
subTotal0.03000100.000002.30769
DieDoped siliconSilicon (Si)7440-21-30.14000100.0000010.76923
subTotal0.14000100.0000010.76923
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.09785
Copper (Cu)7440-50-80.5009094.5100038.53100
Tin (Sn)7440-31-50.001270.240000.09785
Zinc (Zn)7440-66-60.001110.210000.08562
Pure metal layerGold (Au)7440-57-50.000370.070000.02854
Nickel (Ni)7440-02-00.022954.330001.76531
Palladium (Pd)7440-05-30.002120.400000.16308
subTotal0.53000100.0000040.76925
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.02308
Silica fused60676-86-00.3060060.0000023.53846
Flame retardantMetal hydroxideProprietary0.015303.000001.17692
ImpurityBismuth (Bi)7440-69-90.002550.500000.19615
PigmentCarbon black1333-86-40.002550.500000.19615
PolymerEpoxy resin systemProprietary0.035707.000002.74615
Phenolic resinProprietary0.030606.000002.35385
subTotal0.51000100.0000039.23076
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000020.055500.00128
Tin solderTin (Sn)7440-31-50.0299899.940002.30631
subTotal0.03000100.000002.30769
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0100099.990000.76915
subTotal0.01000100.000000.76923
total1.30000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.