Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBHV9040X-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934666534115PBHV9040X-QXPBHV9040X-QSOT89 (MPT3)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1100 ppm; substance 7439-92-1: <1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1100 ppm; substance 7439-92-1: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 7890 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.28475085.0000000.633451
AdhesivePolymerResin system0.05025015.0000000.111785
Adhesive Total0.335000100.0000000.745236
DieDoped siliconSilicon (Si)7440-21-30.390000100.0000000.867588
Die Total0.390000100.0000000.867588
Lead FrameCopper alloyCopper (Cu)7440-50-817.37587499.41000038.654120
Lead FrameCopper alloyIron (Fe)7439-89-60.0262180.1500000.058324
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0069920.0400000.015554
Base Alloy C19210 Total17.40908499.60000038.727998
Lead FramePure metal layerSilver (Ag)7440-22-40.0699160.4000000.155534
Pre-Plating Total0.0699160.4000000.155534
Lead Frame Total17.479000100.00000038.883532
Mould CompoundFillerSilica fused60676-86-022.42139986.15000049.878322
Mould CompoundPolymerEpoxy resin system2.2564548.6700005.019675
Mould CompoundHardenerPhenolic resin1.1165154.2900002.483783
Mould CompoundActive agentNon-declarable0.1067080.4100000.237381
Mould CompoundFillerSilica7631-86-90.0754750.2900000.167901
Mould CompoundPigmentCarbon black1333-86-40.0494490.1900000.110004
Mould Compound Total26.026000100.00000057.897066
Post-PlatingTin solderTin (Sn)7440-31-50.70757599.9400001.574061
Post-PlatingImpurityNon-declarable0.0003930.0555000.000875
Post-PlatingImpurityLead (Pb)7439-92-10.0000320.0045000.000071
Post-Plating Total0.708000100.0000001.575007
WirePure metalCopper (Cu)7440-50-80.014192100.0000000.031571
Wire Total0.014192100.0000000.031571
PBHV9040X-Q Total44.952192100.000000
Notes
Report created on 2026-01-19 19:12:30 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2026-01-19 19:12:30 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Component
有毒有害物质或元素 (Toxic and hazardous substances or elements)
Pb (铅) 铅 Lead Hg (汞) 汞 Mercury Cd (镉) 镉 Cadmium Cr6+ (六价铬) 六价铬 Chromium VI PBB (多溴联苯) 多溴联苯
Polybrominated biphenyls
PBDE (多溴二苯醚) 多溴二苯醚
Polybrominated diphenyl ethers
DEHP (邻苯二甲酸二(2-乙基己)酯) 邻苯二甲酸二(2-乙基己)酯
Di(2-ethylhexyl) phthalate
BBP (邻苯二甲酸丁苄酯) 邻苯二甲酸丁苄酯
Butyl benzyl phthalate
DBP (邻苯二甲酸二丁酯) 邻苯二甲酸二丁酯
Dibutyl phthalate
DIBP (邻苯二甲酸二异丁酯) 邻苯二甲酸二异丁酯
Diisobutyl phthalate
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层 (Pre-Plating)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件的所有均质材料中的含量均符合 GB/T 26572 规定的限量要求。
Indicates that the content of the hazardous substance in all homogeneous materials of this part complies with the limit requirements of GB/T 26572.
表示该有害物质在该部件的至少一种均质材料中的含量超过 GB/T 26572 规定的限量要求(如适用,符合相关豁免要求)。
Indicates that the content of the hazardous substance in at least one homogeneous material of this part exceeds the limit requirements of GB/T 26572 (where applicable, in accordance with relevant exemptions).
EFUP Icon 该半导体产品符合中国 RoHS 要求,适用"e"标识,环境保护使用期限(EFUP)标识不适用。
This semiconductor product complies with China RoHS requirements and bears the "e" mark; therefore, the Environmental Friendly Use Period (EFUP) marking is not applicable.
注:EFUP 的确定基于产品在正常使用条件下的环境与可靠性评估。
Note: The EFUP is determined based on environmental and reliability assessments under normal operating conditions.
Notes
Report created on 2026-01-19 19:12:30 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.