×

Chemical content PBHV9115T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBHV9115TSOT23TO-236AB8.22194 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934061417235112601235D-22529 HAMBURG, Germany; Dongguan, China 
9340614172151412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.44000100.000005.35154
subTotal0.44000100.000005.35154
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.02996
Carbon (C)7440-44-00.001090.040000.01332
Chromium (Cr)7440-47-30.006020.220000.07324
Cobalt (Co)7440-48-40.011770.430000.14314
Iron (Fe)7439-89-61.3132147.9800015.97205
Manganese (Mn)7439-96-50.023540.860000.28629
Nickel (Ni)7440-02-00.9891536.1400012.03064
Phosphorus (P)7723-14-00.000550.020000.00666
Silicon (Si)7440-21-30.007120.260000.08655
Sulphur (S)7704-34-90.000550.020000.00666
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.78496
Silver (Ag)7440-22-40.070342.570000.85553
subTotal2.73700100.0000033.28900
Mould CompoundFillerSilica fused60676-86-03.4349871.0000041.77822
PigmentCarbon black1333-86-40.014510.300000.17653
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9530919.7000011.59198
Phenolic resinProprietary0.435429.000005.29583
subTotal4.83800100.0000058.84256
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000110.055500.00128
Tin solderTin (Sn)7440-31-50.1898999.940002.30950
subTotal0.19000100.000002.31088
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0169499.990000.20601
subTotal0.01694100.000000.20603
total8.22194100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.