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Chemical content PBHV9115X

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Type numberPackagePackage descriptionTotal product weight
PBHV9115XSOT89MPT345.00219 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340614221151012601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63275
PolymerResin systemProprietary0.0502515.000000.11166
subTotal0.33500100.000000.74441
DieDoped siliconSilicon (Si)7440-21-30.44000100.000000.97773
subTotal0.44000100.000000.97773
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.61117
Iron (Fe)7439-89-60.026220.150000.05826
Phosphorus (P)7723-14-00.006990.040000.01554
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15536
subTotal17.47900100.0000038.84033
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23711
FillerSilica -amorphous-7631-86-90.075480.290000.16771
Silica fused60676-86-022.4214086.1500049.82291
HardenerPhenolic resinProprietary1.116524.290002.48102
PigmentCarbon black1333-86-40.049450.190000.10988
PolymerEpoxy resin systemProprietary2.256458.670005.01410
subTotal26.02600100.0000057.83273
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.57231
subTotal0.70800100.000001.57325
WirePure metalCopper (Cu)7440-50-80.01419100.000000.03154
subTotal0.01419100.000000.03154
total45.00219100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.