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Chemical content PBHV9515QA

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Type numberPackagePackage descriptionTotal product weight
PBHV9515QASOT1215DFN1010D-31.26000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069065147412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02381
FillerSilver (Ag)7440-22-40.0252084.000002.00000
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23810
Isobornyl Methacrylate7534-94-30.001505.000000.11905
subTotal0.03000100.000002.38096
DieDoped siliconSilicon (Si)7440-21-30.15000100.0000011.90476
subTotal0.15000100.0000011.90476
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10095
Copper (Cu)7440-50-80.5009094.5100039.75421
Tin (Sn)7440-31-50.001270.240000.10095
Zinc (Zn)7440-66-60.001110.210000.08833
Pure metal layerGold (Au)7440-57-50.000370.070000.02944
Nickel (Ni)7440-02-00.022954.330001.82135
Palladium (Pd)7440-05-30.002120.400000.16825
subTotal0.53000100.0000042.06348
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.30952
Silica fused60676-86-00.3060060.0000024.28571
Flame retardantMetal hydroxideProprietary0.015303.000001.21429
ImpurityBismuth (Bi)7440-69-90.002550.500000.20238
PigmentCarbon black1333-86-40.002550.500000.20238
PolymerEpoxy resin systemProprietary0.035707.000002.83333
Phenolic resinProprietary0.030606.000002.42857
subTotal0.51000100.0000040.47618
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00132
Tin solderTin (Sn)7440-31-50.0299899.940002.37952
subTotal0.03000100.000002.38095
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0100099.990000.79357
subTotal0.01000100.000000.79365
total1.26000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.