Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBRN123ET

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBRN123ETSOT23TO-236AB7.808300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405899221513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.210000100.0000002.689446
subTotal0.210000100.0000002.689446
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029380
Carbon (C)7440-44-00.0010200.0400000.013058
Chromium (Cr)7440-47-30.0056080.2200000.071818
Cobalt (Co)7440-48-40.0109610.4300000.140372
Iron (Fe)7439-89-61.22301047.98000015.662951
Manganese (Mn)7439-96-50.0219210.8600000.280745
Nickel (Ni)7440-02-00.92120936.14000011.797813
Phosphorus (P)7723-14-00.0005100.0200000.006529
Silicon (Si)7440-21-30.0066270.2600000.084876
Sulphur (S)7704-34-90.0005100.0200000.006529
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.711708
Silver (Ag)7440-22-40.0655092.5700000.838970
subTotal2.549000100.00000032.644750
Mould CompoundFillerSilica fused60676-86-03.44492071.00000044.118694
PigmentCarbon black1333-86-40.0145560.3000000.186417
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.95584419.70000012.241384
Phenolic resinProprietary0.4366809.0000005.592511
subTotal4.852000100.00000062.139006
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000107
Non hazardousProprietary0.0001030.0555000.001315
Tin solderTin (Sn)7440-31-50.18488999.9400002.367852
subTotal0.185000100.0000002.369274
WirePure metalGold (Au)7440-57-50.012250100.0000000.156884
subTotal0.012250100.0000000.156884
total7.808300100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.