Chemical content PBSS2515MB

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Type numberPackagePackage descriptionTotal product weight
PBSS2515MBSOT883BXQFN30.70050 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340658753155126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32548
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04484
Phenolic resinProprietary0.0004113.530000.05794
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.13776
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09593
Copper (Cu)7440-50-80.2632094.0000037.57316
Tin (Sn)7440-31-50.000670.240000.09593
Zinc (Zn)7440-66-60.000590.210000.08394
Pure metal layerGold (Au)7440-57-50.000220.080000.03198
Nickel (Ni)7440-02-00.013834.940001.97459
Palladium (Pd)7440-05-30.000810.290000.11592
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.16345
Silica fused60676-86-00.2040060.0000029.12206
Flame retardantMetal hydroxideProprietary0.010203.000001.45610
ImpurityBismuth (Bi)7440-69-90.001700.500000.24268
PigmentCarbon black1333-86-40.001700.500000.24268
PolymerEpoxy resin systemProprietary0.023807.000003.39757
Phenolic resinProprietary0.020406.000002.91221
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00158
Tin solderTin (Sn)7440-31-50.0199999.940002.85339
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0075099.990001.07098
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.