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Chemical content PBSS2540M

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Type numberPackagePackage descriptionTotal product weight
PBSS2540MSOT883 dummy POVXQFN30.88768 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340571573151512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.85616
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11795
Phenolic resinProprietary0.0013513.530000.15242
subTotal0.01000100.000001.12653
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.63266
subTotal0.05000100.000005.63266
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.24863
Magnesium (Mg)7439-95-40.000630.146000.07072
Nickel (Ni)7440-02-00.012532.913001.41108
Silicon (Si)7440-21-30.002710.631000.30566
MetallisationGold (Au)7440-57-50.000150.035000.01695
Nickel (Ni)7440-02-00.011852.755001.33455
Palladium (Pd)7440-05-30.000470.110000.05328
subTotal0.43000100.0000048.44087
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.58679
Silica fused60676-86-00.2220060.0000025.00901
Flame retardantMetal hydroxideProprietary0.011103.000001.25045
ImpurityBismuth (Bi)7440-69-90.001850.500000.20841
PigmentCarbon black1333-86-40.001850.500000.20841
PolymerEpoxy resin systemProprietary0.025907.000002.91772
Phenolic resinProprietary0.022206.000002.50090
subTotal0.37000100.0000041.68169
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.12586
subTotal0.01000100.000001.12654
WireImpurityNon hazardousProprietary0.000000.010000.00020
Pure metalGold (Au)7440-57-50.0176899.990001.99151
subTotal0.01768100.000001.99171
total0.88768100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.