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Chemical content PBSS2540MB

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Type numberPackagePackage descriptionTotal product weight
PBSS2540MBSOT883BXQFN30.70044 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065876315412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32551
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04484
Phenolic resinProprietary0.0004113.530000.05795
subTotal0.00300100.000000.42830
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.13837
subTotal0.05000100.000007.13837
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09594
Copper (Cu)7440-50-80.2632094.0000037.57638
Tin (Sn)7440-31-50.000670.240000.09594
Zinc (Zn)7440-66-60.000590.210000.08395
Pure metal layerGold (Au)7440-57-50.000220.080000.03198
Nickel (Ni)7440-02-00.013834.940001.97476
Palladium (Pd)7440-05-30.000810.290000.11593
subTotal0.28000100.0000039.97488
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.16441
Silica fused60676-86-00.2040060.0000029.12455
Flame retardantMetal hydroxideProprietary0.010203.000001.45623
ImpurityBismuth (Bi)7440-69-90.001700.500000.24270
PigmentCarbon black1333-86-40.001700.500000.24270
PolymerEpoxy resin systemProprietary0.023807.000003.39786
Phenolic resinProprietary0.020406.000002.91246
subTotal0.34000100.0000048.54091
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00158
Tin solderTin (Sn)7440-31-50.0199999.940002.85363
subTotal0.02000100.000002.85534
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0074499.990001.06237
subTotal0.00744100.000001.06248
total0.70044100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.