Chemical content PBSS303NX

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Type numberPackagePackage descriptionTotal product weight
PBSS303NXSOT89MPT345.92437 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405900911513126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.62004
PolymerResin systemProprietary0.0502515.000000.10942
DieDoped siliconSilicon (Si)7440-21-31.26000100.000002.74364
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100037.83585
Iron (Fe)7439-89-60.026220.150000.05709
Phosphorus (P)7723-14-00.006990.040000.01522
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15224
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23235
FillerSilica -amorphous-7631-86-90.075480.290000.16435
Silica fused60676-86-022.4214086.1500048.82244
HardenerPhenolic resinProprietary1.116524.290002.43120
PigmentCarbon black1333-86-40.049450.190000.10768
PolymerEpoxy resin systemProprietary2.256458.670004.91341
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00086
Tin solderTin (Sn)7440-31-50.7075899.940001.54074
WireImpurityNon hazardousProprietary0.000010.010000.00003
Pure metalCopper (Cu)7440-50-80.1163699.990000.25338
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.