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Chemical content PBSS4130QA

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Type numberPackagePackage descriptionTotal product weight
PBSS4130QASOT1215DFN1010D-31.27071 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067165147312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02361
FillerSilver (Ag)7440-22-40.0252084.000001.98314
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23609
Isobornyl Methacrylate7534-94-30.001505.000000.11804
subTotal0.03000100.000002.36088
DieDoped siliconSilicon (Si)7440-21-30.16000100.0000012.59139
subTotal0.16000100.0000012.59139
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10010
Copper (Cu)7440-50-80.5009094.5100039.41914
Tin (Sn)7440-31-50.001270.240000.10010
Zinc (Zn)7440-66-60.001110.210000.08759
Pure metal layerGold (Au)7440-57-50.000370.070000.02920
Nickel (Ni)7440-02-00.022954.330001.80600
Palladium (Pd)7440-05-30.002120.400000.16684
subTotal0.53000100.0000041.70897
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.23106
Silica fused60676-86-00.3060060.0000024.08103
Flame retardantMetal hydroxideProprietary0.015303.000001.20405
ImpurityBismuth (Bi)7440-69-90.002550.500000.20068
PigmentCarbon black1333-86-40.002550.500000.20068
PolymerEpoxy resin systemProprietary0.035707.000002.80945
Phenolic resinProprietary0.030606.000002.40810
subTotal0.51000100.0000040.13505
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00131
Tin solderTin (Sn)7440-31-50.0299899.940002.35947
subTotal0.03000100.000002.36089
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0107199.990000.84291
subTotal0.01071100.000000.84299
total1.27071100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.