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Chemical content PBSS4260QA

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Type numberPackagePackage descriptionTotal product weight
PBSS4260QASOT1215DFN1010D-31.27608 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067162147312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02351
FillerSilver (Ag)7440-22-40.0252084.000001.97480
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23509
Isobornyl Methacrylate7534-94-30.001505.000000.11755
subTotal0.03000100.000002.35095
DieDoped siliconSilicon (Si)7440-21-30.16000100.0000012.53840
subTotal0.16000100.0000012.53840
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.09968
Copper (Cu)7440-50-80.5009094.5100039.25326
Tin (Sn)7440-31-50.001270.240000.09968
Zinc (Zn)7440-66-60.001110.210000.08722
Pure metal layerGold (Au)7440-57-50.000370.070000.02907
Nickel (Ni)7440-02-00.022954.330001.79840
Palladium (Pd)7440-05-30.002120.400000.16613
subTotal0.53000100.0000041.53344
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.19221
Silica fused60676-86-00.3060060.0000023.97969
Flame retardantMetal hydroxideProprietary0.015303.000001.19898
ImpurityBismuth (Bi)7440-69-90.002550.500000.19983
PigmentCarbon black1333-86-40.002550.500000.19983
PolymerEpoxy resin systemProprietary0.035707.000002.79763
Phenolic resinProprietary0.030606.000002.39797
subTotal0.51000100.0000039.96614
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00130
Tin solderTin (Sn)7440-31-50.0299899.940002.34954
subTotal0.03000100.000002.35095
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0160899.990001.25998
subTotal0.01608100.000001.26011
total1.27608100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.