Chemical content PBSS4310PAS-Q

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Type number	Package	Package description	Total product weight
PBSS4310PAS-Q	SOT1061D	HUSON3	7.89530 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934663832115	3	1	260		1	235			D-22529 HAMBURG, Germany; Dongguan, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Additive	Non hazardous	Proprietary	0.00110	1.00000	0.01393
	Filler	Silver (Ag)	7440-22-4	0.09240	84.00000	1.17032
	Polymer	Bismaleimidodiphenylmethane resin		0.01100	10.00000	0.13932
		Isobornyl Methacrylate	7534-94-3	0.00550	5.00000	0.06966
		subTotal		0.11000	100.00000	1.39323

Die	Doped silicon	Silicon (Si)	7440-21-3	0.46200	100.00000	5.85158
		subTotal		0.46200	100.00000	5.85158

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.63127	93.84000	33.32709
		Magnesium (Mg)	7439-95-4	0.01402	0.50000	0.17757
		Nickel (Ni)	7440-02-0	0.10375	3.70000	1.31405
		Silicon (Si)	7440-21-3	0.02243	0.80000	0.28412
	Pure metal layer	Gold (Au)	7440-57-5	0.00168	0.06000	0.02131
		Nickel (Ni)	7440-02-0	0.02804	1.00000	0.35515
		Palladium (Pd)	7440-05-3	0.00280	0.10000	0.03551
		subTotal		2.80400	100.00000	35.51480

Mould Compound	Additive	Non hazardous	Proprietary	0.01747	0.41000	0.22122
	Filler	Silica -amorphous-	7631-86-9	0.01235	0.29000	0.15647
		Silica fused	60676-86-0	3.66999	86.15000	46.48322
	Hardener	Phenolic resin	Proprietary	0.18275	4.29000	2.31472
	Pigment	Carbon black	1333-86-4	0.00809	0.19000	0.10252
	Polymer	Epoxy resin system	Proprietary	0.36934	8.67000	4.67800
		subTotal		4.26000	100.00000	53.95615

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00001	0.00450	0.00010
		Non hazardous	Proprietary	0.00009	0.05550	0.00120
	Tin solder	Tin (Sn)	7440-31-5	0.16990	99.94000	2.15189
		subTotal		0.17000	100.00000	2.15319

Wire	Impurity	Non hazardous	Proprietary	0.00001	0.01000	0.00011
	Pure metal	Copper (Cu)	7440-50-8	0.08924	99.99000	1.13031
		subTotal		0.08925	100.00000	1.13042

		total		7.89530	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.