Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS4330PAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS4330PASSOT1061DHUSON37.686906 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340681061154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.144804
PolymerAcrylic resinProprietary0.02200020.0000000.286201
subTotal0.110000100.0000001.431005
DieDoped siliconSilicon (Si)7440-21-30.320000100.0000004.162923
subTotal0.320000100.0000004.162923
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.230594
Magnesium (Mg)7439-95-40.0140200.5000000.182388
Nickel (Ni)7440-02-00.1037483.7000001.349672
Silicon (Si)7440-21-30.0224320.8000000.291821
Pure metal layerGold (Au)7440-57-50.0016820.0600000.021887
Nickel (Ni)7440-02-00.0280401.0000000.364776
Palladium (Pd)7440-05-30.0028040.1000000.036478
subTotal2.804000100.00000036.477615
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.227218
FillerSilica -amorphous-7631-86-90.0123540.2900000.160715
Silica fused60676-86-03.66999086.15000047.743396
HardenerPhenolic resinProprietary0.1827544.2900002.377472
PigmentCarbon black1333-86-40.0080940.1900000.105296
PolymerEpoxy resin systemProprietary0.3693428.6700004.804820
subTotal4.260000100.00000055.418916
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000100
Non hazardousProprietary0.0000940.0555000.001227
Tin solderTin (Sn)7440-31-50.16989899.9400002.210226
subTotal0.170000100.0000002.211553
WireImpurityNon hazardousProprietary0.0000020.0100000.000030
Pure metalCopper (Cu)7440-50-80.02290399.9900000.297954
subTotal0.022906100.0000000.297984
total7.686906100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.