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Chemical content PBSS4330X

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Type numberPackagePackage descriptionTotal product weight
PBSS4330XSOT89MPT345.03122 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340580361351512601235D-22529 HAMBURG, Germany; Dongguan, China 
9340580361151412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63234
PolymerResin systemProprietary0.0502515.000000.11159
subTotal0.33500100.000000.74393
DieDoped siliconSilicon (Si)7440-21-30.44000100.000000.97710
subTotal0.44000100.000000.97710
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.58628
Iron (Fe)7439-89-60.026220.150000.05822
Phosphorus (P)7723-14-00.006990.040000.01553
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15526
subTotal17.47900100.0000038.81529
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23696
FillerSilica -amorphous-7631-86-90.075480.290000.16761
Silica fused60676-86-022.4214086.1500049.79079
HardenerPhenolic resinProprietary1.116524.290002.47943
PigmentCarbon black1333-86-40.049450.190000.10981
PolymerEpoxy resin systemProprietary2.256458.670005.01087
subTotal26.02600100.0000057.79547
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.57130
subTotal0.70800100.000001.57224
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0432299.990000.09598
subTotal0.04323100.000000.09599
total45.03122100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.