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Chemical content PBSS5250TH

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Type numberPackagePackage descriptionTotal product weight
PBSS5250THSOT23TO-236AB8.30805 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071077215212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.44000100.000005.29607
subTotal0.44000100.000005.29607
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.02965
Carbon (C)7440-44-00.001090.040000.01318
Chromium (Cr)7440-47-30.006020.220000.07248
Cobalt (Co)7440-48-40.011770.430000.14166
Iron (Fe)7439-89-61.3132147.9800015.80651
Manganese (Mn)7439-96-50.023540.860000.28332
Nickel (Ni)7440-02-00.9891536.1400011.90594
Phosphorus (P)7723-14-00.000550.020000.00659
Silicon (Si)7440-21-30.007120.260000.08565
Sulphur (S)7704-34-90.000550.020000.00659
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.74573
Silver (Ag)7440-22-40.070342.570000.84666
subTotal2.73700100.0000032.94396
Mould CompoundFillerSilica fused60676-86-03.6941775.1000044.46493
PigmentCarbon black1333-86-40.014760.300000.17762
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.8608217.5000010.36134
Phenol Formaldehyde resin (generic)9003-35-40.349257.100004.20374
subTotal4.91900100.0000059.20763
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000110.055500.00127
Tin solderTin (Sn)7440-31-50.1898999.940002.28557
subTotal0.19000100.000002.28694
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0220599.990000.26538
subTotal0.02205100.000000.26541
total8.30805100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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