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Chemical content PBSS5260QA

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Type numberPackagePackage descriptionTotal product weight
PBSS5260QASOT1215DFN1010D-31.27623 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067164147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02351
FillerSilver (Ag)7440-22-40.0252084.000001.97457
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23507
Isobornyl Methacrylate7534-94-30.001505.000000.11753
subTotal0.03000100.000002.35068
DieDoped siliconSilicon (Si)7440-21-30.16000100.0000012.53693
subTotal0.16000100.0000012.53693
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.09967
Copper (Cu)7440-50-80.5009094.5100039.24865
Tin (Sn)7440-31-50.001270.240000.09967
Zinc (Zn)7440-66-60.001110.210000.08721
Pure metal layerGold (Au)7440-57-50.000370.070000.02907
Nickel (Ni)7440-02-00.022954.330001.79819
Palladium (Pd)7440-05-30.002120.400000.16611
subTotal0.53000100.0000041.52857
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.19113
Silica fused60676-86-00.3060060.0000023.97687
Flame retardantMetal hydroxideProprietary0.015303.000001.19884
ImpurityBismuth (Bi)7440-69-90.002550.500000.19981
PigmentCarbon black1333-86-40.002550.500000.19981
PolymerEpoxy resin systemProprietary0.035707.000002.79730
Phenolic resinProprietary0.030606.000002.39769
subTotal0.51000100.0000039.96145
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00130
Tin solderTin (Sn)7440-31-50.0299899.940002.34926
subTotal0.03000100.000002.35067
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0162399.990001.27174
subTotal0.01623100.000001.27187
total1.27623100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.