×

Chemical content PBSS5350T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5350TSOT23TO-236AB7.94440 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934056605235412601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
9340566052151412601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.13000100.000001.63637
subTotal0.13000100.000001.63637
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.03101
Carbon (C)7440-44-00.001090.040000.01378
Chromium (Cr)7440-47-30.006020.220000.07579
Cobalt (Co)7440-48-40.011770.430000.14814
Iron (Fe)7439-89-61.3132147.9800016.53004
Manganese (Mn)7439-96-50.023540.860000.29629
Nickel (Ni)7440-02-00.9891536.1400012.45093
Phosphorus (P)7723-14-00.000550.020000.00689
Silicon (Si)7440-21-30.007120.260000.08958
Sulphur (S)7704-34-90.000550.020000.00689
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.91719
Silver (Ag)7440-22-40.070342.570000.88541
subTotal2.73700100.0000034.45194
Mould CompoundAdditiveNon hazardousProprietary0.141082.900001.77591
Triphenylphosphine603-35-00.002430.050000.03062
FillerSilica -amorphous-7631-86-93.5028072.0000044.09144
PigmentCarbon black1333-86-40.002430.050000.03062
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7297515.000009.18572
Phenol Formaldehyde resin (generic)9003-35-40.4865010.000006.12381
subTotal4.86500100.0000061.23812
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00133
Tin solderTin (Sn)7440-31-50.1898999.940002.39019
subTotal0.19000100.000002.39163
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0224099.990000.28193
subTotal0.02240100.000000.28196
total7.94440100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.