Chemical content PBSS5360PAS-Q

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Type number	Package	Package description	Total product weight
PBSS5360PAS-Q	SOT1061D	HUSON3	7.69812 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934664536115	2	1	260	30 s	1	235	20 s	3	D-22529 HAMBURG, Germany; Dongguan, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Additive	Non hazardous	Proprietary	0.00110	1.00000	0.01429
	Filler	Silver (Ag)	7440-22-4	0.09240	84.00000	1.20029
	Polymer	Bismaleimidodiphenylmethane resin		0.01100	10.00000	0.14289
		Isobornyl Methacrylate	7534-94-3	0.00550	5.00000	0.07145
		subTotal		0.11000	100.00000	1.42892

Die	Doped silicon	Silicon (Si)	7440-21-3	0.32000	100.00000	4.15686
		subTotal		0.32000	100.00000	4.15686

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.63127	93.84000	34.18073
		Magnesium (Mg)	7439-95-4	0.01402	0.50000	0.18212
		Nickel (Ni)	7440-02-0	0.10375	3.70000	1.34771
		Silicon (Si)	7440-21-3	0.02243	0.80000	0.29140
	Pure metal layer	Gold (Au)	7440-57-5	0.00168	0.06000	0.02185
		Nickel (Ni)	7440-02-0	0.02804	1.00000	0.36424
		Palladium (Pd)	7440-05-3	0.00280	0.10000	0.03642
		subTotal		2.80400	100.00000	36.42447

Mould Compound	Additive	Non hazardous	Proprietary	0.01747	0.41000	0.22689
	Filler	Silica -amorphous-	7631-86-9	0.01235	0.29000	0.16048
		Silica fused	60676-86-0	3.66999	86.15000	47.67385
	Hardener	Phenolic resin	Proprietary	0.18275	4.29000	2.37401
	Pigment	Carbon black	1333-86-4	0.00809	0.19000	0.10514
	Polymer	Epoxy resin system	Proprietary	0.36934	8.67000	4.79782
		subTotal		4.26000	100.00000	55.33819

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00001	0.00450	0.00010
		Non hazardous	Proprietary	0.00009	0.05550	0.00123
	Tin solder	Tin (Sn)	7440-31-5	0.16990	99.94000	2.20701
		subTotal		0.17000	100.00000	2.20834

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00004
	Pure metal	Copper (Cu)	7440-50-8	0.03412	99.99000	0.44325
		subTotal		0.03412	100.00000	0.44329

		total		7.69812	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.