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Chemical content PBSS5360PAS-Q

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Type numberPackagePackage descriptionTotal product weight
PBSS5360PAS-QSOT1061DHUSON37.69812 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346645361152126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01429
FillerSilver (Ag)7440-22-40.0924084.000001.20029
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14289
Isobornyl Methacrylate7534-94-30.005505.000000.07145
subTotal0.11000100.000001.42892
DieDoped siliconSilicon (Si)7440-21-30.32000100.000004.15686
subTotal0.32000100.000004.15686
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.18073
Magnesium (Mg)7439-95-40.014020.500000.18212
Nickel (Ni)7440-02-00.103753.700001.34771
Silicon (Si)7440-21-30.022430.800000.29140
Pure metal layerGold (Au)7440-57-50.001680.060000.02185
Nickel (Ni)7440-02-00.028041.000000.36424
Palladium (Pd)7440-05-30.002800.100000.03642
subTotal2.80400100.0000036.42447
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22689
FillerSilica -amorphous-7631-86-90.012350.290000.16048
Silica fused60676-86-03.6699986.1500047.67385
HardenerPhenolic resinProprietary0.182754.290002.37401
PigmentCarbon black1333-86-40.008090.190000.10514
PolymerEpoxy resin systemProprietary0.369348.670004.79782
subTotal4.26000100.0000055.33819
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00123
Tin solderTin (Sn)7440-31-50.1699099.940002.20701
subTotal0.17000100.000002.20834
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0341299.990000.44325
subTotal0.03412100.000000.44329
total7.69812100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.