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Chemical content PDTA113EMB

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Type numberPackagePackage descriptionTotal product weight
PDTA113EMBSOT883BXQFN30.69020 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065918315612601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33034
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04551
Phenolic resinProprietary0.0004113.530000.05881
subTotal0.00300100.000000.43466
DieDoped siliconSilicon (Si)7440-21-30.04000100.000005.79542
subTotal0.04000100.000005.79542
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09736
Copper (Cu)7440-50-80.2632094.0000038.13387
Tin (Sn)7440-31-50.000670.240000.09736
Zinc (Zn)7440-66-60.000590.210000.08519
Pure metal layerGold (Au)7440-57-50.000220.080000.03245
Nickel (Ni)7440-02-00.013834.940002.00406
Palladium (Pd)7440-05-30.000810.290000.11765
subTotal0.28000100.0000040.56794
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.33005
Silica fused60676-86-00.2040060.0000029.55665
Flame retardantMetal hydroxideProprietary0.010203.000001.47783
ImpurityBismuth (Bi)7440-69-90.001700.500000.24631
PigmentCarbon black1333-86-40.001700.500000.24631
PolymerEpoxy resin systemProprietary0.023807.000003.44828
Phenolic resinProprietary0.020406.000002.95567
subTotal0.34000100.0000049.26110
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00161
Tin solderTin (Sn)7440-31-50.0199999.940002.89597
subTotal0.02000100.000002.89771
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0072099.990001.04278
subTotal0.00720100.000001.04288
total0.69020100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.