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Chemical content PDTA113ZMB

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Type numberPackagePackage descriptionTotal product weight
PDTA113ZMBSOT883BXQFN30.69025 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065919315512601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33032
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04551
Phenolic resinProprietary0.0004113.530000.05880
subTotal0.00300100.000000.43463
DieDoped siliconSilicon (Si)7440-21-30.04000100.000005.79500
subTotal0.04000100.000005.79500
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09736
Copper (Cu)7440-50-80.2632094.0000038.13111
Tin (Sn)7440-31-50.000670.240000.09736
Zinc (Zn)7440-66-60.000590.210000.08519
Pure metal layerGold (Au)7440-57-50.000220.080000.03245
Nickel (Ni)7440-02-00.013834.940002.00391
Palladium (Pd)7440-05-30.000810.290000.11764
subTotal0.28000100.0000040.56502
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.32923
Silica fused60676-86-00.2040060.0000029.55451
Flame retardantMetal hydroxideProprietary0.010203.000001.47773
ImpurityBismuth (Bi)7440-69-90.001700.500000.24629
PigmentCarbon black1333-86-40.001700.500000.24629
PolymerEpoxy resin systemProprietary0.023807.000003.44803
Phenolic resinProprietary0.020406.000002.95545
subTotal0.34000100.0000049.25753
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00161
Tin solderTin (Sn)7440-31-50.0199999.940002.89576
subTotal0.02000100.000002.89750
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0072599.990001.04978
subTotal0.00725100.000001.04988
total0.69025100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.