Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA114YMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA114YMBSOT883BXQFN30.709917 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065922315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.321164
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044245
Phenolic resinProprietary0.00040613.5300000.057176
subTotal0.003000100.0000000.422585
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000008.451692
subTotal0.060000100.0000008.451692
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.094659
Copper (Cu)7440-50-80.26320094.00000037.074757
Tin (Sn)7440-31-50.0006720.2400000.094659
Zinc (Zn)7440-66-60.0005880.2100000.082827
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031553
Nickel (Ni)7440-02-00.0138324.9400001.948397
Palladium (Pd)7440-05-30.0008120.2900000.114380
subTotal0.280000100.00000039.441230
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.015372
Silica fused60676-86-00.20400060.00000028.735754
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.436788
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.239465
PigmentCarbon black1333-86-40.0017000.5000000.239465
PolymerEpoxy resin systemProprietary0.0238007.0000003.352505
Phenolic resinProprietary0.0204006.0000002.873575
subTotal0.340000100.00000047.892923
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000127
Non hazardousProprietary0.0000110.0555000.001564
Tin solderTin (Sn)7440-31-50.01998899.9400002.815540
subTotal0.020000100.0000002.817231
WireImpurityNon hazardousProprietary0.0000010.0100000.000097
Pure metalGold (Au)7440-57-50.00691799.9900000.974298
subTotal0.006917100.0000000.974396
total0.709917100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.