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Chemical content PDTA124TMB

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Type numberPackagePackage descriptionTotal product weight
PDTA124TMBSOT883BXQFN30.71612 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065936315612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.31838
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04386
Phenolic resinProprietary0.0004113.530000.05668
subTotal0.00300100.000000.41892
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.37848
subTotal0.06000100.000008.37848
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09384
Copper (Cu)7440-50-80.2632094.0000036.75362
Tin (Sn)7440-31-50.000670.240000.09384
Zinc (Zn)7440-66-60.000590.210000.08211
Pure metal layerGold (Au)7440-57-50.000220.080000.03128
Nickel (Ni)7440-02-00.013834.940001.93152
Palladium (Pd)7440-05-30.000810.290000.11339
subTotal0.28000100.0000039.09960
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000010.91996
Silica fused60676-86-00.2040060.0000028.48685
Flame retardantMetal hydroxideProprietary0.010203.000001.42434
ImpurityBismuth (Bi)7440-69-90.001700.500000.23739
PigmentCarbon black1333-86-40.001700.500000.23739
PolymerEpoxy resin systemProprietary0.023807.000003.32347
Phenolic resinProprietary0.020406.000002.84868
subTotal0.34000100.0000047.47808
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00155
Tin solderTin (Sn)7440-31-50.0199999.940002.79115
subTotal0.02000100.000002.79283
WireImpurityNon hazardousProprietary0.000000.010000.00018
Pure metalGold (Au)7440-57-50.0131299.990001.83207
subTotal0.01312100.000001.83225
total0.71612100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.