Chemical content PDTA143EQC

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Type numberPackagePackage descriptionTotal product weight
PDTA143EQCSOT8009DFN1412D-32.40866 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660905147112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.44174
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.06086
Phenolic resinProprietary0.0018913.530000.07864
DieDoped siliconSilicon (Si)7440-21-30.02600100.000001.07944
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792045.23266
Magnesium (Mg)7439-95-40.001700.145400.07051
Nickel (Ni)7440-02-00.033982.908901.41057
Silicon (Si)7440-21-30.007360.630300.30564
Pure metal layerGold (Au)7440-57-50.000440.037300.01809
Nickel (Ni)7440-02-00.033552.872201.39278
Palladium (Pd)7440-05-30.001480.126700.06144
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.68411
Silica fused60676-86-00.8906280.0920036.97587
PigmentCarbon black1333-86-40.010320.928000.42843
PolymerEpoxy resin systemProprietary0.093968.450003.90109
Phenolic resinProprietary0.028362.550001.17725
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000050.055500.00191
Tin solderTin (Sn)7440-31-50.0829599.940003.44383
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0056699.990000.23500
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.