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Chemical content PDTA143XMB

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Type numberPackagePackage descriptionTotal product weight
PDTA143XMBSOT883BXQFN30.71008 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066055315512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32109
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04423
Phenolic resinProprietary0.0004113.530000.05716
subTotal0.00300100.000000.42248
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.44975
subTotal0.06000100.000008.44975
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09464
Copper (Cu)7440-50-80.2632094.0000037.06625
Tin (Sn)7440-31-50.000670.240000.09464
Zinc (Zn)7440-66-60.000590.210000.08281
Pure metal layerGold (Au)7440-57-50.000220.080000.03155
Nickel (Ni)7440-02-00.013834.940001.94795
Palladium (Pd)7440-05-30.000810.290000.11435
subTotal0.28000100.0000039.43219
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.01284
Silica fused60676-86-00.2040060.0000028.72916
Flame retardantMetal hydroxideProprietary0.010203.000001.43646
ImpurityBismuth (Bi)7440-69-90.001700.500000.23941
PigmentCarbon black1333-86-40.001700.500000.23941
PolymerEpoxy resin systemProprietary0.023807.000003.35174
Phenolic resinProprietary0.020406.000002.87292
subTotal0.34000100.0000047.88194
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81489
subTotal0.02000100.000002.81658
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0070899.990000.99727
subTotal0.00708100.000000.99737
total0.71008100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.