Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTC114TMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC114TMBSOT883BXQFN30.710643 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065954315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.320836
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044199
Phenolic resinProprietary0.00040613.5300000.057117
subTotal0.003000100.0000000.422153
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000008.443058
subTotal0.060000100.0000008.443058
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.094562
Copper (Cu)7440-50-80.26320094.00000037.036881
Tin (Sn)7440-31-50.0006720.2400000.094562
Zinc (Zn)7440-66-60.0005880.2100000.082742
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031521
Nickel (Ni)7440-02-00.0138324.9400001.946406
Palladium (Pd)7440-05-30.0008120.2900000.114263
subTotal0.280000100.00000039.400937
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.004119
Silica fused60676-86-00.20400060.00000028.706397
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.435320
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.239220
PigmentCarbon black1333-86-40.0017000.5000000.239220
PolymerEpoxy resin systemProprietary0.0238007.0000003.349080
Phenolic resinProprietary0.0204006.0000002.870640
subTotal0.340000100.00000047.843995
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000127
Non hazardousProprietary0.0000110.0555000.001562
Tin solderTin (Sn)7440-31-50.01998899.9400002.812664
subTotal0.020000100.0000002.814353
WireImpurityNon hazardousProprietary0.0000010.0100000.000108
Pure metalGold (Au)7440-57-50.00764399.9900001.075440
subTotal0.007643100.0000001.075547
total0.710643100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.