Chemical content PDTC114TT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC114TTSOT23TO-236AB7.69041 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340349002351712601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
9340349002151512601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000000.91022
Lead FrameIron-nickel alloyChromium (Cr)7440-47-30.005610.220000.07292
Phosphorus (P)7723-14-00.000510.020000.00663
Cobalt (Co)7440-48-40.010960.430000.14252
Manganese (Mn)7439-96-50.021920.860000.28505
Iron (Fe)7439-89-61.2230147.9800015.90306
Nickel (Ni)7440-02-00.9212136.1400011.97867
Silicon (Si)7440-21-30.006630.260000.08618
Aluminium (Al)7429-90-50.002290.090000.02983
Carbon (C)7440-44-00.001020.040000.01326
Sulphur (S)7704-34-90.000510.020000.00663
Pure metal layerSilver (Ag)7440-22-40.065512.570000.85183
Copper (Cu)7440-50-80.2898211.370003.76861
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.83984
FillerSilica -amorphous-7631-86-93.5128872.0000045.67871
PigmentCarbon black1333-86-40.002440.050000.03172
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.51640
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.34427
Post-PlatingImpurityCopper (Cu)7440-50-80.000000.001000.00002
Bismuth (Bi)7440-69-90.000000.001000.00002
Lead (Pb)7439-92-10.000010.005000.00012
Antimony (Sb)7440-36-00.000010.003000.00007
Tin solderTin (Sn)7440-31-50.1849899.990002.40535
WirePure metalCopper (Cu)7440-50-80.00741100.000000.09639
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.