Chemical content PDTC115TMB

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Type numberPackagePackage descriptionTotal product weight
PDTC115TMBSOT883BXQFN30.71062 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934065952315612601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32085
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04420
Phenolic resinProprietary0.0004113.530000.05712
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.44333
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09457
Copper (Cu)7440-50-80.2632094.0000037.03808
Tin (Sn)7440-31-50.000670.240000.09457
Zinc (Zn)7440-66-60.000590.210000.08274
Pure metal layerGold (Au)7440-57-50.000220.080000.03152
Nickel (Ni)7440-02-00.013834.940001.94647
Palladium (Pd)7440-05-30.000810.290000.11427
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.00447
Silica fused60676-86-00.2040060.0000028.70733
Flame retardantMetal hydroxideProprietary0.010203.000001.43537
ImpurityBismuth (Bi)7440-69-90.001700.500000.23923
PigmentCarbon black1333-86-40.001700.500000.23923
PolymerEpoxy resin systemProprietary0.023807.000003.34919
Phenolic resinProprietary0.020406.000002.87073
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81276
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0076299.990001.07290
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.