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Chemical content PDTC123EM

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Type numberPackagePackage descriptionTotal product weight
PDTC123EMSOT883XQFN30.88580 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340582883151612601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.85798
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11820
Phenolic resinProprietary0.0013513.530000.15274
subTotal0.01000100.000001.12892
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.77354
subTotal0.06000100.000006.77354
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.34466
Magnesium (Mg)7439-95-40.000630.146000.07087
Nickel (Ni)7440-02-00.012532.913001.41408
Silicon (Si)7440-21-30.002710.631000.30631
MetallisationGold (Au)7440-57-50.000150.035000.01699
Nickel (Ni)7440-02-00.011852.755001.33738
Palladium (Pd)7440-05-30.000470.110000.05340
subTotal0.43000100.0000048.54369
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.60713
Silica fused60676-86-00.2220060.0000025.06209
Flame retardantMetal hydroxideProprietary0.011103.000001.25310
ImpurityBismuth (Bi)7440-69-90.001850.500000.20885
PigmentCarbon black1333-86-40.001850.500000.20885
PolymerEpoxy resin systemProprietary0.025907.000002.92391
Phenolic resinProprietary0.022206.000002.50621
subTotal0.37000100.0000041.77014
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.12825
subTotal0.01000100.000001.12893
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0057999.990000.65415
subTotal0.00580100.000000.65422
total0.88580100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.