×

Chemical content PDTC123EMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC123EMBSOT883BXQFN30.66508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065948315612601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0030476.000000.45709
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0004210.470000.06297
Phenolic resinProprietary0.0005413.530000.08137
subTotal0.00400100.000000.60143
DieDoped siliconSilicon (Si)7440-21-30.06000100.000009.02147
subTotal0.06000100.000009.02147
Lead FrameCopper alloyCopper (Cu)7440-50-80.2494291.0300037.50259
Magnesium (Mg)7439-95-40.000470.170000.07004
Nickel (Ni)7440-02-00.007782.840001.17002
Silicon (Si)7440-21-30.001700.620000.25543
Pure metal layerGold (Au)7440-57-50.000220.080000.03296
Nickel (Ni)7440-02-00.013624.970002.04754
Palladium (Pd)7440-05-30.000790.290000.11947
subTotal0.27400100.0000041.19805
Mould CompoundFillerSilica -amorphous-7631-86-90.0685423.0000010.30553
Silica fused60676-86-00.1788060.0000026.88398
Flame retardantMetal hydroxideProprietary0.008943.000001.34420
ImpurityBismuth (Bi)7440-69-90.001490.500000.22403
PigmentCarbon black1333-86-40.001490.500000.22403
PolymerEpoxy resin systemProprietary0.020867.000003.13646
Phenolic resinProprietary0.017886.000002.68840
subTotal0.29800100.0000044.80663
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00184
Tin solderTin (Sn)7440-31-50.0219999.940003.30589
subTotal0.02200100.000003.30788
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0070899.990001.06383
subTotal0.00708100.000001.06394
total0.66508100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.