Chemical content PDTC123YM

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Type numberPackagePackage descriptionTotal product weight
PDTC123YMSOT883XQFN30.86580 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340588283151612601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.87780
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12093
Phenolic resinProprietary0.0013513.530000.15627
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.62000
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.39212
Magnesium (Mg)7439-95-40.000630.146000.07251
Nickel (Ni)7440-02-00.012532.913001.44674
Silicon (Si)7440-21-30.002710.631000.31339
MetallisationGold (Au)7440-57-50.000150.035000.01738
Nickel (Ni)7440-02-00.011852.755001.36827
Palladium (Pd)7440-05-30.000470.110000.05463
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.82906
Silica fused60676-86-00.2220060.0000025.64103
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.011103.000001.28205
Ion trapping agentBismuth (Bi)7440-69-90.001850.500000.21368
PigmentCarbon black1333-86-40.001850.500000.21368
PolymerEpoxy resin systemProprietary0.025907.000002.99145
Phenolic resinProprietary0.022206.000002.56410
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00064
Tin solderTin (Sn)7440-31-50.0099999.940001.15431
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0057999.990000.66926
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.