Chemical content PDTC124XQC-Q

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Type number	Package	Package description	Total product weight
PDTC124XQC-Q	SOT8009	DFN1412D-3	2.49577 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934663505147	2	1	260		1	235			Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.00532	76.00000	0.21316
	Polymer	Formaldehyde, polymer with (chloromethyl)oxirane and phenol	9003-36-5	0.00073	10.47000	0.02937
		Phenolic resin	Proprietary	0.00095	13.53000	0.03795
		subTotal		0.00700	100.00000	0.28048

Die	Doped silicon	Silicon (Si)	7440-21-3	0.05000	100.00000	2.00339
		subTotal		0.05000	100.00000	2.00339

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	1.08950	93.27920	43.65390
		Magnesium (Mg)	7439-95-4	0.00170	0.14540	0.06805
		Nickel (Ni)	7440-02-0	0.03398	2.90890	1.36134
		Silicon (Si)	7440-21-3	0.00736	0.63030	0.29498
	Pure metal layer	Gold (Au)	7440-57-5	0.00044	0.03730	0.01746
		Nickel (Ni)	7440-02-0	0.03355	2.87220	1.34417
		Palladium (Pd)	7440-05-3	0.00148	0.12670	0.05929
		subTotal		1.16800	100.00000	46.79919

Mould Compound	Additive	Non hazardous	Proprietary	0.00485	0.41000	0.19418
	Filler	Silica -amorphous-	7631-86-9	0.00343	0.29000	0.13734
		Silica fused	60676-86-0	1.01829	86.15000	40.80075
	Hardener	Phenolic resin	Proprietary	0.05071	4.29000	2.03175
	Pigment	Carbon black	1333-86-4	0.00225	0.19000	0.08998
	Polymer	Epoxy resin system	Proprietary	0.10248	8.67000	4.10612
		subTotal		1.18200	100.00000	47.36012

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00000	0.00450	0.00015
		Non hazardous	Proprietary	0.00005	0.05550	0.00185
	Tin solder	Tin (Sn)	7440-31-5	0.08295	99.94000	3.32363
		subTotal		0.08300	100.00000	3.32563

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00002
	Pure metal	Copper (Cu)	7440-50-8	0.00577	99.99000	0.23125
		subTotal		0.00577	100.00000	0.23127

		total		2.49577	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.