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Chemical content PDTC143EMB

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Type numberPackagePackage descriptionTotal product weight
PDTC143EMBSOT883BXQFN30.70992 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065939315512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32116
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04424
Phenolic resinProprietary0.0004113.530000.05718
subTotal0.00300100.000000.42258
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.45166
subTotal0.06000100.000008.45166
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09466
Copper (Cu)7440-50-80.2632094.0000037.07460
Tin (Sn)7440-31-50.000670.240000.09466
Zinc (Zn)7440-66-60.000590.210000.08283
Pure metal layerGold (Au)7440-57-50.000220.080000.03155
Nickel (Ni)7440-02-00.013834.940001.94839
Palladium (Pd)7440-05-30.000810.290000.11438
subTotal0.28000100.0000039.44107
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.01533
Silica fused60676-86-00.2040060.0000028.73563
Flame retardantMetal hydroxideProprietary0.010203.000001.43678
ImpurityBismuth (Bi)7440-69-90.001700.500000.23946
PigmentCarbon black1333-86-40.001700.500000.23946
PolymerEpoxy resin systemProprietary0.023807.000003.35249
Phenolic resinProprietary0.020406.000002.87356
subTotal0.34000100.0000047.89271
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81553
subTotal0.02000100.000002.81722
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0069299.990000.97429
subTotal0.00692100.000000.97439
total0.70992100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.