Chemical content PDTD114ET

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Type numberPackagePackage descriptionTotal product weight
PDTD114ETSOT23TO-236AB7.72441 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934031040215512601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934031040235612601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.64730
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02970
Carbon (C)7440-44-00.001020.040000.01320
Chromium (Cr)7440-47-30.005610.220000.07260
Cobalt (Co)7440-48-40.010960.430000.14190
Iron (Fe)7439-89-61.2230147.9800015.83306
Manganese (Mn)7439-96-50.021920.860000.28379
Nickel (Ni)7440-02-00.9212136.1400011.92594
Phosphorus (P)7723-14-00.000510.020000.00660
Silicon (Si)7440-21-30.006630.260000.08580
Sulphur (S)7704-34-90.000510.020000.00660
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.75202
Silver (Ag)7440-22-40.065512.570000.84808
Mould CompoundFillerSilica fused60676-86-03.7046875.1000047.96072
PigmentCarbon black1333-86-40.014800.300000.19159
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.8632817.5000011.17593
Phenol Formaldehyde resin (generic)9003-35-40.350247.100004.53424
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00133
Tin solderTin (Sn)7440-31-50.1848999.940002.39357
WirePure metalCopper (Cu)7440-50-80.00741100.000000.09597
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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