×

Chemical content PESD24VF1BLS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD24VF1BLS-QSOD882BDDFN1006-20.90566 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665227315212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0174876.000001.93008
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0024110.470000.26589
Phenolic resinProprietary0.0031113.530000.34361
subTotal0.02300100.000002.53958
DieDoped siliconSilicon (Si)7440-21-30.04200100.000004.63750
subTotal0.04200100.000004.63750
Lead FrameCopper alloyCopper (Cu)7440-50-80.3825295.6300042.23660
Magnesium (Mg)7439-95-40.000600.150000.06625
Nickel (Ni)7440-02-00.011922.980001.31617
Silicon (Si)7440-21-30.002600.650000.28708
Pure metal layerGold (Au)7440-57-50.000040.010000.00442
Nickel (Ni)7440-02-00.002200.550000.24292
Palladium (Pd)7440-05-30.000120.030000.01325
subTotal0.40000100.0000044.16669
Mould CompoundFillerSilica -amorphous-7631-86-90.032407.980003.57737
Silica fused60676-86-00.3251780.0920035.90459
PigmentCarbon black1333-86-40.003770.928000.41601
PolymerEpoxy resin systemProprietary0.034318.450003.78807
Phenolic resinProprietary0.010352.550001.14314
subTotal0.40600100.0000044.82918
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000020.055500.00190
Tin solderTin (Sn)7440-31-50.0309899.940003.42086
subTotal0.03100100.000003.42291
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0036699.990000.40408
subTotal0.00366100.000000.40412
total0.90566100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.