Chemical content PESD24VS4UD-Q

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Type numberPackagePackage descriptionTotal product weight
PESD24VS4UD-QSOT457SC-7411.28215 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346649561151126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.32000100.000002.83634
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003640.090000.03231
Carbon (C)7440-44-00.001620.040000.01436
Chromium (Cr)7440-47-30.008500.210000.07538
Cobalt (Co)7440-48-40.017010.420000.15077
Iron (Fe)7439-89-61.9148447.2800016.97230
Manganese (Mn)7439-96-50.034420.850000.30513
Nickel (Ni)7440-02-01.4426135.6200012.78666
Phosphorus (P)7723-14-00.000810.020000.00718
Silicon (Si)7440-21-30.010120.250000.08974
Sulphur (S)7704-34-90.000810.020000.00718
Pure metal layerCopper (Cu)7440-50-80.5293413.070004.69179
Silver (Ag)7440-22-40.086262.130000.76461
Mould CompoundFillerSilica fused60676-86-04.4020071.0000039.01739
PigmentCarbon black1333-86-40.018600.300000.16486
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2214019.7000010.82595
Phenolic resinProprietary0.558009.000004.94587
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00023
Tin solderTin (Sn)7440-31-50.5199599.990004.60859
WirePure metalGold (Au)7440-57-50.19215100.000001.70316
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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