×

Chemical content PESD2CANFD36UU-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD36UU-QSOT323SC-705.50366 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663357135412601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934663357115412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07400100.000001.34456
subTotal0.07400100.000001.34456
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03015
Carbon (C)7440-44-00.000740.040000.01340
Chromium (Cr)7440-47-30.001660.090000.03015
Cobalt (Co)7440-48-40.007930.430000.14407
Iron (Fe)7439-89-60.8196644.4500014.89296
Manganese (Mn)7439-96-50.012720.690000.23118
Nickel (Ni)7440-02-00.6341534.3900011.52236
Phosphorus (P)7723-14-00.000370.020000.00670
Silicon (Si)7440-21-30.004790.260000.08711
Sulphur (S)7704-34-90.000370.020000.00670
Pure metal layerCopper (Cu)7440-50-80.3203017.370005.81981
Silver (Ag)7440-22-40.039652.150000.72036
subTotal1.84400100.0000033.50495
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.77573
Triphenylphosphine603-35-00.001680.050000.03062
FillerSilica -amorphous-7631-86-92.4264072.0000044.08703
PigmentCarbon black1333-86-40.001680.050000.03062
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000009.18480
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000006.12320
subTotal3.37000100.0000061.23200
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.81526
subTotal0.21000100.000003.81564
WirePure metalCopper (Cu)7440-50-80.00566100.000000.10288
subTotal0.00566100.000000.10288
total5.50366100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.