Chemical content PESD2CANFD36VU-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD36VU-QSOT323SC-705.52674 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663356115412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
934663356135412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09700100.000001.75510
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03003
Carbon (C)7440-44-00.000740.040000.01335
Chromium (Cr)7440-47-30.001660.090000.03003
Cobalt (Co)7440-48-40.007930.430000.14347
Iron (Fe)7439-89-60.8196644.4500014.83077
Manganese (Mn)7439-96-50.012720.690000.23022
Nickel (Ni)7440-02-00.6341534.3900011.47424
Phosphorus (P)7723-14-00.000370.020000.00667
Silicon (Si)7440-21-30.004790.260000.08675
Sulphur (S)7704-34-90.000370.020000.00667
Pure metal layerCopper (Cu)7440-50-80.3203017.370005.79551
Silver (Ag)7440-22-40.039652.150000.71735
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.76831
FillerSilica -amorphous-7631-86-92.4264072.0000043.90292
PigmentCarbon black1333-86-40.001680.050000.03049
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000009.14644
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000006.09763
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.79933
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0057499.990000.10378
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.