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Chemical content PESD2IVN24-U

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Type numberPackagePackage descriptionTotal product weight
PESD2IVN24-USOT323SC-705.57175 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070277115312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.14000100.000002.51268
subTotal0.14000100.000002.51268
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001620.090000.02908
Carbon (C)7440-44-00.000720.040000.01292
Chromium (Cr)7440-47-30.003780.210000.06784
Cobalt (Co)7440-48-40.007560.420000.13568
Iron (Fe)7439-89-60.8490647.1700015.23866
Manganese (Mn)7439-96-50.015300.850000.27460
Nickel (Ni)7440-02-00.6397235.5400011.48149
Phosphorus (P)7723-14-00.000360.020000.00646
Silicon (Si)7440-21-30.004500.250000.08076
Sulphur (S)7704-34-90.000360.020000.00646
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.21591
Silver (Ag)7440-22-40.042122.340000.75596
subTotal1.80000100.0000032.30582
Mould CompoundFillerSilica fused60676-86-02.5534075.1000045.82761
PigmentCarbon black1333-86-40.010200.300000.18307
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.67887
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.33257
subTotal3.40000100.0000061.02212
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.76864
subTotal0.21000100.000003.76902
WirePure metalCopper (Cu)7440-50-80.02175100.000000.39043
subTotal0.02175100.000000.39043
total5.57175100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.