Chemical content PESD2USB5UVT-Q

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Type numberPackagePackage descriptionTotal product weight
PESD2USB5UVT-QSOT23TO-236AB8.86433 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934666039215112601235D-22529 HAMBURG, Germany; Nijmegen, Netherlands; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34746
PolymerResin systemProprietary0.0092023.000000.10379
DieDoped siliconSilicon (Si)7440-21-30.08500100.000000.95890
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.93639
Iron (Fe)7439-89-60.082912.520000.93530
Lead (Pb)7439-92-10.000990.030000.01113
Phosphorus (P)7723-14-00.004940.150000.05567
Zinc (Zn)7440-66-60.006250.190000.07052
Pure metal layerSilver (Ag)7440-22-40.098042.980001.10603
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23450
FillerSilica -amorphous-7631-86-90.014700.290000.16587
Silica fused60676-86-04.3678086.1500049.27394
HardenerPhenolic resinProprietary0.217504.290002.45369
PigmentCarbon black1333-86-40.009630.190000.10867
PolymerEpoxy resin systemProprietary0.439578.670004.95885
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00219
Tin solderTin (Sn)7440-31-50.3497999.940003.94604
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0293399.990000.33084
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.