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Chemical content PESD30VF1BL

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Type numberPackagePackage descriptionTotal product weight
PESD30VF1BLSOD882DFN1006-20.94396 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660742315412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80512
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11092
Phenolic resinProprietary0.0013513.530000.14333
subTotal0.01000100.000001.05937
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.29683
subTotal0.05000100.000005.29683
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.04083
Magnesium (Mg)7439-95-40.000820.200000.08687
Nickel (Ni)7440-02-00.012923.150001.36817
Silicon (Si)7440-21-30.002830.690000.29969
Pure metal layerGold (Au)7440-57-50.000120.030000.01303
Nickel (Ni)7440-02-00.005211.270000.55161
Palladium (Pd)7440-05-30.000700.170000.07384
subTotal0.41000100.0000043.43404
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.96445
Silica fused60676-86-00.2700060.0000028.60291
Flame retardantMetal hydroxideProprietary0.013503.000001.43015
ImpurityBismuth (Bi)7440-69-90.002250.500000.23836
PigmentCarbon black1333-86-40.002250.500000.23836
PolymerEpoxy resin systemProprietary0.031507.000003.33701
Phenolic resinProprietary0.027006.000002.86029
subTotal0.45000100.0000047.67153
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.11746
subTotal0.02000100.000002.11874
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0039699.990000.42000
subTotal0.00397100.000000.42004
total0.94396100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.