Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD36VS1ULS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD36VS1ULSSOD882BDDFN1006-20.900400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346617193152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.603732
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.220935
Phenolic resinProprietary0.00257113.5300000.285506
subTotal0.019000100.0000002.110173
DieDoped siliconSilicon (Si)7440-21-30.039000100.0000004.331408
subTotal0.039000100.0000004.331408
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.939138
Magnesium (Mg)7439-95-40.0005920.1500000.065804
Nickel (Ni)7440-02-00.0117712.9800001.307308
Silicon (Si)7440-21-30.0025680.6500000.285151
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004387
Nickel (Ni)7440-02-00.0022520.5700000.250056
Palladium (Pd)7440-05-30.0001580.0400000.017548
subTotal0.395000100.00000043.869391
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.748934
Silica fused60676-86-00.33878980.09200037.626517
PigmentCarbon black1333-86-40.0039250.9280000.435966
PolymerEpoxy resin systemProprietary0.0357448.4500003.969736
Phenolic resinProprietary0.0107862.5500001.197968
subTotal0.423000100.00000046.979120
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000100
Non hazardousProprietary0.0000110.0555000.001233
Tin solderTin (Sn)7440-31-50.01998899.9400002.219902
subTotal0.020000100.0000002.221235
WireImpurityNon hazardousProprietary0.0000000.0100000.000049
Pure metalGold (Au)7440-57-50.00440099.9900000.488623
subTotal0.004400100.0000000.488672
total0.900400100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.