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Chemical content PESD3V3L1UL

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Type numberPackagePackage descriptionTotal product weight
PESD3V3L1ULSOD882DFN1006-20.92500 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340629883151112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82162
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11319
Phenolic resinProprietary0.0013513.530000.14627
subTotal0.01000100.000001.08108
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24324
subTotal0.03000100.000003.24324
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.88205
Magnesium (Mg)7439-95-40.000820.200000.08865
Nickel (Ni)7440-02-00.012923.150001.39622
Silicon (Si)7440-21-30.002830.690000.30584
Pure metal layerGold (Au)7440-57-50.000120.030000.01330
Nickel (Ni)7440-02-00.005211.270000.56292
Palladium (Pd)7440-05-30.000700.170000.07535
subTotal0.41000100.0000044.32433
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.18919
Silica fused60676-86-00.2700060.0000029.18919
Flame retardantMetal hydroxideProprietary0.013503.000001.45946
ImpurityBismuth (Bi)7440-69-90.002250.500000.24324
PigmentCarbon black1333-86-40.002250.500000.24324
PolymerEpoxy resin systemProprietary0.031507.000003.40541
Phenolic resinProprietary0.027006.000002.91892
subTotal0.45000100.0000048.64865
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16086
subTotal0.02000100.000002.16216
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0048099.990000.51887
subTotal0.00480100.000000.51892
total0.92500100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.