×

Chemical content PESD3V3S4UF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD3V3S4UFdummy POV SOT886XSON61.98416 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934061196115812601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0380076.000001.91517
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0052410.470000.26384
Phenolic resinProprietary0.0067613.530000.34095
subTotal0.05000100.000002.51996
DieDoped siliconSilicon (Si)7440-21-30.11000100.000005.54391
subTotal0.11000100.000005.54391
Lead FrameCopper alloyCopper (Cu)7440-50-80.7244391.7000036.51066
Magnesium (Mg)7439-95-40.001340.170000.06769
Nickel (Ni)7440-02-00.024173.060001.21835
Silicon (Si)7440-21-30.005450.690000.27473
Pure metal layerGold (Au)7440-57-50.000470.060000.02389
Nickel (Ni)7440-02-00.031203.950001.57271
Palladium (Pd)7440-05-30.002920.370000.14732
subTotal0.79000100.0000039.81535
Mould CompoundFillerSilica -amorphous-7631-86-90.2300023.0000011.59181
Silica fused60676-86-00.6000060.0000030.23950
Flame retardantMetal hydroxideProprietary0.030003.000001.51197
ImpurityBismuth (Bi)7440-69-90.005000.500000.25200
PigmentCarbon black1333-86-40.005000.500000.25200
PolymerEpoxy resin systemProprietary0.070007.000003.52794
Phenolic resinProprietary0.060006.000003.02395
subTotal1.00000100.0000050.39917
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.51182
subTotal0.03000100.000001.51199
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0041699.990000.20964
subTotal0.00416100.000000.20966
total1.98416100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.