Chemical content PESD3V3S4UF

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Type numberPackagePackage descriptionTotal product weight
PESD3V3S4UFdummy POV SOT886XSON61.98416 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340611961158126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0380076.000001.91517
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0052410.470000.26384
Phenolic resinProprietary0.0067613.530000.34095
DieDoped siliconSilicon (Si)7440-21-30.11000100.000005.54391
Lead FrameCopper alloyCopper (Cu)7440-50-80.7244391.7000036.51066
Magnesium (Mg)7439-95-40.001340.170000.06769
Nickel (Ni)7440-02-00.024173.060001.21835
Silicon (Si)7440-21-30.005450.690000.27473
Pure metal layerGold (Au)7440-57-50.000470.060000.02389
Nickel (Ni)7440-02-00.031203.950001.57271
Palladium (Pd)7440-05-30.002920.370000.14732
Mould CompoundFillerSilica -amorphous-7631-86-90.2300023.0000011.59181
Silica fused60676-86-00.6000060.0000030.23950
Flame retardantMetal hydroxideProprietary0.030003.000001.51197
ImpurityBismuth (Bi)7440-69-90.005000.500000.25200
PigmentCarbon black1333-86-40.005000.500000.25200
PolymerEpoxy resin systemProprietary0.070007.000003.52794
Phenolic resinProprietary0.060006.000003.02395
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.51182
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0041699.990000.20964
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.