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Chemical content PESD3V3T1BLD

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Type numberPackagePackage descriptionTotal product weight
PESD3V3T1BLDSOD882DDFN1006-20.66040 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660348315312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.34525
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04756
Phenolic resinProprietary0.0004113.530000.06146
subTotal0.00300100.000000.45427
DieDoped siliconSilicon (Si)7440-21-30.02000100.000003.02847
subTotal0.02000100.000003.02847
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.12165
Copper (Cu)7440-50-80.2957694.7950044.78504
Tin (Sn)7440-31-50.000750.238800.11282
Zinc (Zn)7440-66-60.000600.190800.09014
Pure metal layerGold (Au)7440-57-50.000170.055000.02598
Nickel (Ni)7440-02-00.013394.292002.02772
Palladium (Pd)7440-05-30.000530.170900.08074
subTotal0.31200100.0000047.24409
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.41339
Silica fused60676-86-00.1794060.0000027.16535
Flame retardantMetal hydroxideProprietary0.008973.000001.35827
ImpurityBismuth (Bi)7440-69-90.001500.500000.22638
PigmentCarbon black1333-86-40.001500.500000.22638
PolymerEpoxy resin systemProprietary0.020937.000003.16929
Phenolic resinProprietary0.017946.000002.71654
subTotal0.29900100.0000045.27560
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00185
Tin solderTin (Sn)7440-31-50.0219999.940003.32932
subTotal0.02200100.000003.33132
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0044099.990000.66620
subTotal0.00440100.000000.66627
total0.66040100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.