Chemical content PESD4USB3BTBR-Q

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Type numberPackagePackage descriptionTotal product weight
PESD4USB3BTBR-QSOT1176-2XSON103.34994 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664533115212601240Dongguan, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0315045.000000.94032
PolymerAcrylic resinProprietary0.0105015.000000.31344
Phenolic resinProprietary0.0105015.000000.31344
Resin systemProprietary0.0175025.000000.52240
DieDoped siliconSilicon (Si)7440-21-30.06400100.000001.91048
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900026.82451
Magnesium (Mg)7439-95-40.001620.170000.04821
Nickel (Ni)7440-02-00.041044.320001.22510
Silicon (Si)7440-21-30.006740.710000.20135
Pure metal layerGold (Au)7440-57-50.000280.030000.00851
Nickel (Ni)7440-02-00.001040.110000.03119
Palladium (Pd)7440-05-30.000480.050000.01418
Silver (Ag)7440-22-40.000190.020000.00567
Mould CompoundFillerSilica -amorphous-7631-86-90.157507.000004.70158
Silica fused60676-86-01.8675083.0000055.74727
PigmentCarbon black1333-86-40.011250.500000.33583
PolymerEpoxy resin systemProprietary0.135006.000004.02992
Phenolic resinProprietary0.078753.500002.35079
WirePure metalGold (Au)7440-57-50.0157899.000000.47107
Palladium (Pd)7440-05-30.000161.000000.00476
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.