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Chemical content PESD4USB5BBTBR-Q

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Type numberPackagePackage descriptionTotal product weight
PESD4USB5BBTBR-QSOT1176-2XSON103.35444 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93466507247141260NA235Dongguan, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0315045.000000.93905
PolymerAcrylic resinProprietary0.0105015.000000.31302
Phenolic resinProprietary0.0105015.000000.31302
Resin systemProprietary0.0175025.000000.52170
subTotal0.07000100.000002.08679
DieDoped siliconSilicon (Si)7440-21-30.06400100.000001.90792
subTotal0.06400100.000001.90792
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900026.78853
Magnesium (Mg)7439-95-40.001620.170000.04815
Nickel (Ni)7440-02-00.041044.320001.22345
Silicon (Si)7440-21-30.006740.710000.20108
Pure metal layerGold (Au)7440-57-50.000280.030000.00850
Nickel (Ni)7440-02-00.001040.110000.03115
Palladium (Pd)7440-05-30.000480.050000.01416
Silver (Ag)7440-22-40.000190.020000.00566
subTotal0.95000100.0000028.32068
Mould CompoundFillerSilica -amorphous-7631-86-90.157507.000004.69527
Silica fused60676-86-01.8675083.0000055.67248
PigmentCarbon black1333-86-40.011250.500000.33538
PolymerEpoxy resin systemProprietary0.135006.000004.02452
Phenolic resinProprietary0.078753.500002.34763
subTotal2.25000100.0000067.07528
WireImpurityNon hazardousProprietary0.000000.000050.00000
Silver (Ag)7440-22-40.000000.001450.00001
Pure metalCopper (Cu)7440-50-80.0197396.548550.58825
Pure metal layerGold (Au)7440-57-50.000090.449960.00274
Palladium (Pd)7440-05-30.000612.999700.01828
subTotal0.02044100.000000.60928
total3.35444100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.