Chemical content PESD5V0S2BQA

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Type numberPackagePackage descriptionTotal product weight
PESD5V0S2BQASOT1215DFN1010D-31.21798 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340695381474126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02463
FillerSilver (Ag)7440-22-40.0252084.000002.06900
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.24631
Isobornyl Methacrylate7534-94-30.001505.000000.12315
DieDoped siliconSilicon (Si)7440-21-30.10000100.000008.21032
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10444
Copper (Cu)7440-50-80.5009094.5100041.12572
Tin (Sn)7440-31-50.001270.240000.10444
Zinc (Zn)7440-66-60.001110.210000.09138
Pure metal layerGold (Au)7440-57-50.000370.070000.03046
Nickel (Ni)7440-02-00.022954.330001.88419
Palladium (Pd)7440-05-30.002120.400000.17406
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.63070
Silica fused60676-86-00.3060060.0000025.12357
Flame retardantMetal hydroxideProprietary0.015303.000001.25618
ImpurityBismuth (Bi)7440-69-90.002550.500000.20936
PigmentCarbon black1333-86-40.002550.500000.20936
PolymerEpoxy resin systemProprietary0.035707.000002.93108
Phenolic resinProprietary0.030606.000002.51236
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00137
Tin solderTin (Sn)7440-31-50.0299899.940002.46162
WireImpurityNon hazardousProprietary0.000000.010000.00015
Pure metalGold (Au)7440-57-50.0179899.990001.47640
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.