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Chemical content PESD5V0S4UF

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Type numberPackagePackage descriptionTotal product weight
PESD5V0S4UFSOT886 dummy POVXSON61.99664 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934061201115912601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0380076.000001.90320
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0052410.470000.26219
Phenolic resinProprietary0.0067613.530000.33882
subTotal0.05000100.000002.50421
DieDoped siliconSilicon (Si)7440-21-30.11000100.000005.50926
subTotal0.11000100.000005.50926
Lead FrameCopper alloyCopper (Cu)7440-50-80.7244391.7000036.28245
Magnesium (Mg)7439-95-40.001340.170000.06726
Nickel (Ni)7440-02-00.024173.060001.21073
Silicon (Si)7440-21-30.005450.690000.27301
Pure metal layerGold (Au)7440-57-50.000470.060000.02374
Nickel (Ni)7440-02-00.031203.950001.56288
Palladium (Pd)7440-05-30.002920.370000.14640
subTotal0.79000100.0000039.56647
Mould CompoundFillerSilica -amorphous-7631-86-90.2300023.0000011.51935
Silica fused60676-86-00.6000060.0000030.05048
Flame retardantMetal hydroxideProprietary0.030003.000001.50252
ImpurityBismuth (Bi)7440-69-90.005000.500000.25042
PigmentCarbon black1333-86-40.005000.500000.25042
PolymerEpoxy resin systemProprietary0.070007.000003.50589
Phenolic resinProprietary0.060006.000003.00505
subTotal1.00000100.0000050.08413
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.50237
subTotal0.03000100.000001.50254
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0166499.990000.83332
subTotal0.01664100.000000.83340
total1.99664100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.